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    d s s g s s d g s s s s ARF1500 beo 135-05 .005 .045 .160 .500 .500 1.065 .207 .207 .375 .105 typ. 1.065 d s g dims: inches hazardous material warning the ceramic portion of the device between leads and mounting surface is beryllium oxide. beryllium oxide dust is highly toxic when inhaled. care must be taken during handling and mounting to avoid damage to this area. these devices must never be thrown away with general industrial or domestic waste. yy arf 1500 compliant layer clamp yyyy heat sink thermal considerations and package mounting: the rated 1500w power dissipation is only available when the package mounting surface is at 25?c and the junction temperature is 200?c. the thermal resistance between junctions and case mounting surface is 0.12 ?c/w. when installed, an addi- tional thermal impedance of 0.09 ?c/w between the package base and the mounting surface is typical. insure that the mounting surface is smooth and flat. thermal joint compound must be used to reduce the effects of small surface irregularities. the heat- sink should incorporate a copper heat spreader to obtain best results. the package is designed to be clamped to a heatsink. a clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. a simple clamp, a compliant layer of plastic or rubber, and two 6-32 (m3.5) screws can provide the minimum 85 lb required mounting force. t = 6 in-lb.


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